Silver-coated Copper
Excellent conductivity
Good thermal stability
High performance
Key words:
Metal powder
Classification:
Product Parameters
Shape | Product specifications | Silver Content (%) | Range of Particle Sizes (μm) | Product Features | Applications |
Spherical type |
TFM-CO2P | 20 | D10:1.5 μm D50:2.5 μm D90:4.5 μm |
Excellent conductivity Good thermal stability High performance |
Printed circuit boards (PCB) Conductive adhesives Touchscreen sensors EMI shielding Conductive adhesive tapes Conductive inks |
TFM-CO5P | 10 | D10:3.5 μm D50:6.0 μm D90:9.5 μm |
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Flaky type | TFM-CO5F | 20 | D10:3.0 μm D50:6.5 μm D90:11.0 μm |
Excellent conductivity Slightly better than the spherical type Good thermal stability High performance |
|
TFM-C15F | 15 | D10:7.5 μm D50:14.0 μm D90:22.0 μm |
Note: The above series of products are produced by Toyo Aluminium K.K. (based in Japan).
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