Silver-coated Copper

Excellent conductivity

Good thermal stability

High performance

Key words:

Metal powder

Classification:

Product Parameters

Shape Product specifications Silver Content (%) Range of Particle Sizes (μm) Product Features Applications
Spherical
type
TFM-CO2P 20 D10:1.5 μm
D50:2.5 μm
D90:4.5 μm
Excellent conductivity
Good thermal stability
High performance
Printed circuit boards (PCB)
Conductive adhesives
Touchscreen sensors
EMI shielding
Conductive adhesive tapes
Conductive inks
TFM-CO5P 10 D10:3.5 μm
D50:6.0 μm
D90:9.5 μm
Flaky type TFM-CO5F 20 D10:3.0 μm
D50:6.5 μm
D90:11.0 μm
Excellent conductivity
Slightly better than the
spherical type
Good thermal stability
High performance
TFM-C15F 15 D10:7.5 μm
D50:14.0 μm
D90:22.0 μm

Note: The above series of products are produced by Toyo Aluminium K.K. (based in Japan).

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